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Build Smarter Boards with ASC Sunstone’s Advanced Capabilities

Engineered for Today’s High-Speed, High-Density Designs.  In an era of shrinking form factors and rising signal speeds, ASC Sunstone delivers the advanced PCB fabrication capabilities electronics design engineers rely on—from prototype to production.

Whether you're developing next-gen IoT devices, high-frequency RF systems, or dense HDI layouts, our via fill and controlled impedance services are built to support the performance, reliability, and precision your designs demand.

Via Fill for Reliability, Planarity, and Thermal Performance

Our via fill process—available in both conductive and non-conductive epoxy—enhances structural integrity, improves thermal management, and provides a smooth surface ideal for BGAs and HDI stack-ups. It’s a proven solution for reducing solder joint failures, mitigating outgassing, and ensuring clean, robust boards that meet today’s tight tolerances.

Controlled Impedance for Signal Integrity at Speed

As data rates climb and signal margins shrink, precision impedance control becomes non-negotiable. ASC Sunstone offers tight-tolerance impedance solutions tailored to your layout specs—optimizing trace widths, spacing, and dielectric properties for consistent performance across high-speed digital and RF applications.

Why ASC Sunstone?

Fast, reliable turnaround from prototype to productionEngineering support to fine-tune your stack-ups and signal pathsProven quality and consistency across complex builds

Let’s build smarter, faster, and better—together. Start your next project with ASC Sunstone and experience fabrication engineered for modern electronics.

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Contact ASC Sunstone Support
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