Join Us For A Webinar On Next-Gen Materials, Next-Level HDI:
Let’s take a practical look at where Ultra HDI is headed—specifically materials, the silent drivers behind next-gen PCB performance.
What’s new and why it matters to you
Recent innovations in material science are changing the rules of what’s possible in high-density interconnect design:
Advanced resin systems and ultra-thin dielectrics are enabling tighter line/space geometries than ever before Next-generation copper and film technologies support finer features with improved signal integrityBuild-up materials with exceptionally low dielectric loss are opening new doors for RF, mmWave, and high-speed digital
Why this matters to PCB designers
Design smarter: Understand real-world materials so you can push density and reliability, not guesswork.Right first time: Align your layouts with fabricator capabilities early: save cost, time, and re-spins.Future-proof boards: Get ahead on substrate-like PCBs, embedded ICs, and trace‑size trends.
What you will walk away with
Knowledge of new developments in materials Recommendations for material-stackup combinations to hit your density or speed goalsA behind-the-scenes peek into ASC’s Ultra HDI fabrication capabilities
Date: September 17, 2025
Time: 9:00 AM Pacific Time (US and Canada)
Your Seat, Your Screen, Your Convenience
Register Now ( https://marketing.sunstone.com/c/AQix0RUQhNswGOf3qZABINndhQyB6_blfo9uMzSl-60ApI8k5VbUVHNZq7T2WTO1zVEtLg )
Contact Sunstone Support
1-800-228-8198 ( 1-800-228-8198 )
email ( support@sunstone.com?subject=Support%20Inquiry ) & chat ( https://marketing.sunstone.com/c/AQix0RUQhNswGOf3qZABINrdhQyU2JD6lvaXlcl7oXFCawjwyiNO1G-3pOEbB-iW8w9MHg )
To unsubscribe from our email, click here https://marketing.sunstone.com/uns/AQix0RUQhNswGOf3qZABSwk3G5wMFu-bJVYFuJcc82B3j_asji4imE0tnMvymbE
Copyright © *2025
ASC Sunstone
All Rights Reserved
13626 S. Freeman Road, Mulino, OR 97042