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INVENTING A SMART FUTURE
SIMCom Newsletter, Dec. 2025
SIMCom News

5G in Action: Connecting the World
As 5G deployment accelerates from factories and hospitals to cities and remote regions, 5G is delivering high-speed, low-latency, and reliable connectivity that bridges the “last mile” — enabling smarter manufacturing, more efficient logistics, real-time healthcare, and sustainable urban development.  
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Accelerating Broadband Access with 5G FWA
As demand for high-speed connectivity accelerates, 5G FWA is emerging as a powerful solution for expanding broadband coverage. Its advantages—higher speeds, lower latency, and improved network efficiency—align perfectly with the capabilities of SIMCom’s SIM8260 series, built on the Qualcomm Snapdragon™ X62 platform.
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【Podcast】How AI is elevating every aspect of our lives
In this episode, we take a closer look at the evolution of smart retail, including smarter vending machines and smart self-service scales, as the industry moves into the era of AI-driven vision. With SIMCom's AI computing modules ranging from 1 TOPS to 48 TOPS, we're helping customers achieve the perfect balance between performance and cost, unlocking the next generation of highly efficient retail devices.
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Enlit Europe 2025
SIMCom highlighted its full smart metering ecosystem, powered by high-speed 5G RedCap, low latency NB-IoT and energy-efficient Cat.1 bis modules, enabling reliable connectivity for electricity, gas, and water utilities. As smart metering evolves, the future is shifting toward deeper intelligence. To support this trend, SIMCom is now working on and accelerating the integration of lightweight AI computing module to enable smarter data processing and predictive fault detection for energy devices.
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MWC Doha 2025
During MWC Doha 2025, SIMCom took the chance to present its advanced 5G WiFi 7 CPE solutions, powered by Qualcomm SDX72/SDX75 and ASR 5G modem platforms. At Booth E46, SIMCom's team is engaging with operators, partners and visitors to demonstrate how these next-generation CPE solutions address the Middle East's rapidly rising demand for high-speed, high-capacity connectivity.
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SIMCom Products
SIM8260
5G NR Module
Multi-Band
VONR/VoLTE
TCP/IP
NSA/SA
Compact Size
USB 3.1
LGA
SSL
GNSS
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SIM8230
5G Sub-6G Module
LGA+LCC
Multi-band
SA
Compact Size
GNSS
TCP/IP
USB 2.0
SSL
   
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SIM66MD
High Precision Dual Frequency GNSS Modules
GNSS
AGNSS
PPS
RTK
L1+L5
UART
Compact Size
SBAS
LNA
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Click for an ideal solution tailored to your product!
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SIMCom Events
MWC26 Barcelona
Date: 2-5 March, 2026
Address: Hall 5 G8, Fira Gran Via, Barcelona
Register Now
Embedded World 2026
Date: 10-12 March. 2026
Address: Hall 3 Stand: 3-525, Nürnberg, Germany 
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Industry News
6 IoT semiconductor predictions for 2026
While many in the semiconductor industry are focused on AI chip innovations for the world’s nearly 12,000 data centers, the chips powering the world’s 20+ billion IoT devices are undergoing significant innovations as well. Below, the IoT Analytics team shares 6 predictions for how the IoT semiconductor space is changing in 2026.
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On-Device AI for IoT Sensors: When Local Inference Finally Makes Sense
In 2026, the momentum behind on-device AI—also known as edge inference or tinyML—has moved well beyond experimentation. Driven by new low-power AI accelerators, maturing development toolchains, and the cost of cloud inference, IoT manufacturers are reassessing where intelligence should sit in connected architectures.
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Sales support: overseas-sales@simcom.com | Technical support: support@simcom.com | Market & Media: marketing@simcom.com
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