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November 22, 2024

ONTRACK MONTHLY

Leading Insights

Mexico to See $890 Million of US Investment

Silicon Valley firms and EMS companies plan $890M in Jalisco for 2025, fueling tech growth and job creation in the Mexican state.

Link >

Cars Are Bringing Back Buttons

Touchscreens have suddenly gone out of style as automobile manufacturers start bringing tactile buttons back to control consoles in new vehicles.

Link >

Semiconductor Sales Up 23.2% YoY/10.7% QoQ

The Semiconductor Industry Association reports sales reached $166 billion in Q3 2024 with the Americas region accounting for 46.3% of total sales.

Link >

New Book on UHDI and Packaging Design

Industry veteran Vern Solberg has released a new book covering UHDI PCBs; advanced packaging; and 2D, 2.5D, 3D and hybrid bond interconnects.

Link >

The Future of FPGAs is Looking Uncertain

Thanks to business models and focus shift from major players like Intel and AMD, it looks like low-end FPGAs will lead future market growth.

Link >

Trending Resources

Latest Design Resources

Wire Bonding: Modern Applications, Technology Trends and Cost Considerations

By Samer Aldhaher

Cost considerations in wire bonding and assembly may not be obvious if you don’t have experience. Luckily, Samer gives readers an expert view on cost considerations for wire bonding and chip-on-board designs.

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Latest Design Resources

Multi-Board PCB Signal Integrity: A Complete Guide

By Zachariah Peterson

Signal integrity in multi-board systems is determined by the signal transmission capabilities of connectors, via transitions, and pinouts. See what determines signal integrity in board-to-board interconnects in this guide.

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FROM THE VAULT

From Mechanical Drilling to Laser Drilling of PCB Microvias

By Zachariah Peterson

Laser drilling will take you all the way down to tiny density interconnects used in ultra-HDI PCBs and substrates for IC packaging. Zach gives an overview of mechanical drilling limits that push designers into a laser drilling process.

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FROM THE VAULT

Common Mode Choke Selection

By Mark Harris

Common-mode chokes can be useful for filtering noise and EMI on coupled lines, but only if they are selected correctly. Learn more about selecting chokes without creating a new signal integrity problem.

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ONTRACK PODCAST

HR 3249 Explained: How it Protects America's PCB Industry

We’re happy to welcome David Schild back onto the Altium OnTrack podcast to discuss the excellent progress PCBAA has made advocating for American PCB manufacturers. Zach caught up with David at this year’s PCB West conference and discussed the organization’s progress, future outlook, and most important moments for legislators.

Listen Now

New Videos & tutorials

Wire Bonding Shorts: 3D Stacked Die with Cavity

Wire bonding and chip-on-board designs can implement stacking of dies without TSVs as vertical interconnects. A simple way to do this is die stacking by using internal cavities to hold each die.

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The Fastest Ways to Run a PCB BOM Review

Run a BOM review early in the design process to spot required part swaps and verify inventories. You can leverage the built-in features in Altium Designer and the new BOM Portal in Altium 365 to quickly run a BOM review.

► Watch Now

ALTIUM ACADEMY

Weekly Webinars

Altium is pleased to offer free weekly webinars that cover basic and advanced challenges that designers and PCB engineers face.

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NEWSLETTERS	PODCASTS	VIDEO	WHITEPAPERS

Altium Europe GmbH, Philipp-Reis-Straße 3, 76137 Karlsruhe, Germany, Tel.: +49 721 8244 300. Managing Directors: Aram Mirkazemi, Kim Besharati, Registered Office: Karlsruhe, Register Court: Mannheim, HRB: 110238. Copyright 2024, Altium LLC, all rights reserved. Altium®, ACTIVEBOM®, ActiveRoute®, Altium Designer®, Altium Vault®, Autotrax®, Camtastic®, Ciiva™, CIIVA SMARTPARTS®, CircuitMaker®, CircuitStudio®, Codemaker™, Common Parts Library™, Draftsman®, DXP™, Easytrax®, LiveDesign®, NanoBoard®, NATIVE 3D™, Octomyze®, Octopart®, PCBWORKS®, P-CAD®, PDN Analyzer™, Protel®, Situs®, Upverter®, XSIGNALS™, X2™ and their respective logos are trademarks or registered trademarks of Altium LLC or its subsidiaries. All other registered or unregistered trademarks referenced herein are the property of their respective owners and no trademark rights to the same are claimed.

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